Equipment performance

Adjustable transmission speed: 0.5-3m/min

Normal operation speed: 2.5m/min

Capacity: up to 4000 / 6800 / 8000 wafers/ H@20mm

Effective utilization rate of equipment: ≥ 98%

Reflectivity: ≤ 16%

Fragment rate: ≤ 0.03%

Silicon wafer specification

Silicon wafer thickness: ≥ 140 μ m

Silicon wafer size: 156.75 * 156.75mm-212 * 212mm

Equipment size 

Length * width * height: 5060 * 2250 * 2120mm

Length * width * height: 3710 * 2650 * 2120mm

Length * width * height: 3810 * 3050 * 2200mm

Working width: 965mm / 1515mm / 1911mm

Transmission height: 1000 ± 25mm

Module material: PP, PVDF

transmission

Transmission type: 5 lane / 8 Lane / 10 Lane

Shaft spacing: 50mm / 60mm

Main drive shaft: 17mm, hexagon

Drive roller: Φ 32mm

direction

Working direction：Left→Right  / Right→Left（TBD）

power supply

Power supply: AC380V 3Ph + PE + n 50Hz (TBD)

Control power supply: DC 24V

Full load power supply: 25A / 48A

Recommended maximum fuse size: 48A / 63A

Installation requirements

Minimum ground bearing capacity: 750KG / ㎡

Minimum workshop height: 3.5m

Clean room level: iso7 (10K class)

Ambient temperature: 17 ℃＜ RT ＜ 30 ℃

Maximum humidity: 70%