Equipment performance

Adjustable transmission speed: 0.5-3m/min

Normal operation speed: 2.5m/min

Capacity: up to 4000 wafers/ H@20mm

Up to 6800 Wafers/ H@20mm

Up to 8000 Wafers/ H@20mm

Effective utilization rate of equipment: ≥ 98%

Etching depth range: 0.7 ~ 6 μ m

Fragment rate: ≤ 0.03%

Silicon wafer specification

Silicon wafer thickness: ≥ 140 μ m

Silicon wafer size: 156.75 * 156.75mm-212 * 212mm

transmission

Transmission type: 5 lane / 6 Lane

Shaft spacing: 50mm / 60mm

Main drive shaft: 17mm, hexagon

Drive roller: Φ 32mm

direction

Working direction：Left→Right/ Right→Left（TBD） 

power supply

Power supply: AC380V 3Ph + PE + n 50Hz (TBD)

Control power supply: DC 24V

Full load power supply: 75A

Recommended maximum fuse size: 100A

Installation requirements

Minimum ground bearing capacity: 75kg / ㎡

Minimum workshop height: 3.5m

Clean room level: iso7 (10K class)

Ambient temperature: 17 ℃＜ RT ＜ 30 ℃

Maximum humidity: 70%